Requirements

Requirements, Customer's expectation, Customer's Preferences

Based on the Customer's need, experience, expectations of the product, ITLPro Solutions will capture all the detailed requirements. For Complex projects, New Innovative Products, Market's benchmarking with similar kind of product features / functionality will be added. ITLPro Solutions Domain Expertise in similar kind of products/segments will be also used.

• Direct Requirements
• Indirect Requirements
• Implicit Requirements
• USP Unique Selling/Marketing Points Requirements
• Statutory/Regulatory Compliance Requirements
• Mass Manufacturing Requirements

• Functionality Requirements
• Feature Requirements
• Performance Requirements
• Safety Requirements
• User Experience Requirements
• Future Requirements
• Modularity Requirements
• Security Requirements
• Ease of Development Requirements
• Data Acquisition, Processing, and Storage Requirements
• Processor/Controller Requirements
• Memory(Hardware) Requirements
• Peripheral Interface Hardware Requirements
• External Interface Hardware Requirements
• Communication Interface Hardware Requirements
• Connectivity Requirements
• Power Requirements
• PCB Requirements
• Operational Requirements
• Product Standards/Benchmarking Requirements
• Mechanical Interface Requirements
• Placement and isolation requirements of specific components like probes, sensors, internal/external connectors, switches, display, antenna, protection devices, filters, high power devices, thermal/optical devices etc.
• Embedded Software Interface Requirements
• Software Interface Requirements
• Hardware Operating Condition Requirements
• Physical Device Design Requirements- form factor, size, weight, and aesthetics
• Cost Requirements
• Development Time Requirements
• Expected Shelf Life Requirements
• Expected Operating Life Requirements
• Reliability Requirements
• Availability Requirements
• Maintainability Requirements
• Prototype Requirements
• Installation/Servicing Requirements
• Special Requirements
• Thermal Requirements
• Control Requirements
• Computation Requirements
• Precision and Accuracy Requirements
• Test and Validation Requirements
• Electromagnetic Compatibility Requirements
• Materials Requirements
• Patient or Clinical (for Medicals) Requirements
• Environmental Requirements
• Timing and Waveform Requirements
• Protocol Analysis and Communication Requirements

Project Planning

Project Planning, Monitoring, Execution and Communication

Project Plan is a blueprint of the information about project schedules, scope, due dates, and deliverables for all phases of the project lifecycle containing Goals and objectives, Scope - Defining the size and boundaries of the project, Schedule - Create a timeline with milestones and deadlines, Resources allocation including personnel, budget, and equipments etc., Communication plan for team to team, team to vendor, team to customer etc.

• Team planning
• Equipment Planning
• Licenses Planning
• Machines Planning
• Critical Path chain Planning
• Meeting, Meeting Resources Planning
• Testing Lab Planning
• External - Third Party Resources Planning
• Critical Components, Main Components Planning
• Components, PCB, Evaluation Boards, Libraries, Specific Tools, etc. Planning and Purchase
• Human Resources, Materials, Equipments, Machines, External Cost Planning and Tracking
• Cost Agreement with Client
• Development Service Level Agreement SLA with Client
• Supplier Agreement with Third Party
• Quality Audit Planning
• Presentations and Meetings
• Risks and Issues
• Responsibilities and Decision Making
• Reviews & Inspections Planning
• Stakeholder Roles/Responsibilities/Concerns

• Goals and Guidelines
• Development Method, Contingencies and Success Plan
• Alternate Plan
• Issues Management
• Risks Identification, Mitigation plan
• Critical Parts Identification
• Key Success or Unique selling Parameters Monitoring and planning
• Dependencies Planning and Monitoring
• Planning of Methods of Verification and Validation
• Planning external Interfaces - Mechanical Interfaces, Embedded Software Interfaces
• Special Requirements Planning
• Periodic Reviews with Client
• Visits to Customers place
• Milestones and Devliveries planning
• Reviews planning and Monitoring
• Priorities
• Tasks Breakdown, scheduling, monitoring, control
• CMMI, ISO, Six-sigma Quality Audits planning and Monitoring

Design

Design - Principles/Theories applied to Requirements, Component selections, Schematic Design, PCB Design

ITLPro Solutions offers a comprehensive suite of design services - from the initial concept to the final product, and our team is involved in every step of the process to ensure high-quality results. ITLPro Solutions dedication to innovation, robust engineering practices, and project management ensures that each component or assembly will function correctly and can be manufactured cost-effectively.

• Design

• Design Principles, Architectural Strategies, Theory, Operation, Calculations, Graph
• Design Recommendations, Best Practices, Calculations, Modeling, Simulation, Performance Analysis, Timing Diagrams Analysis and waveform analysis
• Design Considerations - Goals and Guidelines, Operational Environment, Development Methods & Contingencies, Architectural Strategies, Performance Engineering, Design Constraints, Future Contingencies
• System Architecture - Functional/Logical System, External Systems, Security Hardware Architecture, Performance Hardware Architecture, Information Architecture, Records Management, Internal Communications Architecture
• Operational Modes - Normal, Maintenance, Power Saving, High Performance, Communication etc.
• Circuit management - Power Circuit, Analog Circuit, Control Circuit, Digital Circuit, High Power Control circuit etc.
• System Assumptions/Constraints/Dependencies/Risks
• Stakeholder Roles/Responsibilities/Concerns
• Design Alternates and best fit solutions
• Power Budget Allocation
• CPU Timing Budget Allocation
• Memory Budget Allocation
• Reproducibility and Repeatability for every Measurement and Performance of circuit
• Experts consultation, research and development (R&D), and proof of concept (POC) to check the feasibility of project
• Modularity and scalability consideration
• Major components - BOM Cost Analysis
• Usability, Maintainability and storage considerations
• Qualification - Defence, Aerospace, Industrial - IP55, IP65, MIL-STD-810, MIL-STD-461, MIL-STD-704, JSS 55555
• Normal operational usage, peak performance usage, Maximum battery saving performance usage

• Schematic Design

• Architectures - Qualcomm, Synaptics, NXP Semiconductor, Nordic Semiconductor, Quectel, Macronix, Micron, Winbond Electronics, KIOXIA America Inc., Analog Devices/Maxim Integrated, ST Microelectronics, OSRAM, Panasonic, Texas Instruments, TDK Corporation, Microchip Technology, Renesas, TE Connectivity, AMP Connectors, Molex, Hirose Electric Co Ltd, Samtec
• Schematic Design - Power Budget Analysis, GPIO Pin Mapping, Schematic, Library Creation, Schematic Drafting, BoM Creation & Finalization
• High Speed Digital Board Designs, Low Speed Digital Board Designs, RF and Wireless Design Solutions, MCU Designs, Power-optimized & Battery Operated Designs, Development Platforms, System-on-Modules (SoM), Embedded Processor Based Designs, Analog and Audio Circuit Designs, Design Estimations/ BOM Optimization, ADCs and DACs, Allegro, OrCAD, Altium, Ki-CAD
• Interfaces Design - MIPI CSI & DSI, LVDS, Ethernet SGMII & RGMII, Ethernet PHY USB, PCI Express, HDMI, CAN, SATA, GPS, GSM, WiFi, Bluetooth, LTE, NFC, AMIC, DMIC, SoundWire, SLIMbus Digital Audio, LPDDR3 LPDDR4 LPDDR4X / LPDDR5, DDR2I DDR3I DDR4 SDRAM, SDIO, SDC, eMMC/UFS, eMCP, Touch Screen, Sensors I2C, SPI, UART
• Layout Design - Footprint Creation, Get the PCB Stack Up, Layout Design, Gerber Release, PCB Fabrication & SMT Assembly, Library Management, Small Footprints, PCB Stack Up Design, Board Size and Net Count, Signal Integrity, Power Integrity, Thermal Analysis, Power Distribution, Component Clearance and Mechanical Constraints, EMI and EMC, Design for Manufacturing (DFM) Analysis, Design for Assembly (DFA) Analysis, Design for Testing (DFT) Analysis, Design Rules and Constraints, Allegro, OrCAD, Altium, Ki-CAD
• Bring up & Product Delivery - Test Cases Preparation & Finalization, PCBA Bring Up, EDVT Report, QA/QC Testing, Final Delivery of Product
• Prototype to Production Ownership, Prototype Development, Manufacturing Support, Mechanical/Enclosure Designing for Products, Design Estimation Optimization, Supply Chain Management, Quality Assurance
• Display, Keyboard Front face - User Interface Design
• Selection of Soc / FPGA / CPLD, MicroProcessor, MicroController, ARM Controller - ARM 7/9/11, AVR, Cortex M0/M3/M4/M7/A8/A7/A9, MIPS, MSP430, PIC, RISC-V, x86/x86-64, Arm Cortex-M, Cortex-R, Cortex-A, AVR, and PIC microcontrollers, 32- and 64-bit microprocessors from Nordic Semiconductor, Texas Instruments, STMicroelectronics, and other manufacturers
• Design clock and control circuit
• Memory Design - DDR1 / DDR2 / DDR3 / DDR4 SDRAM, NOR / NAND Flash, EEPROM, CF / MMC / uSD, External Memory etc
• Team specializes in C/C++ development with real-time operating systems (FreeRTOS, Zephyr, ThreadX, RTEMS, LiteOS, NuttX, TI-RTOS, Nucleus RTOS, Linux, custom RTOS) and RTOS.
• Power Supply Design
• Short Circuit, Over-Current, Over-Voltage, Under-Voltage, Harmonics, ESD, EFT, Surge etc. Protection
• Power Distribution Design
• Expansion Card Design
• Connectors, Headers & Jumpers Setting
• Analogue to Digital Convertor (ADC)
• Design Debug connectors and connector pin out definitions
• Design for Other external circuitry like Reset, mode selection - debug, normal, stepping etc.
• Design for communication peripheral connections - RS232, RS422, RS485, USB, HDMI, I2S, TDM, UART, USART, SPI, MIPI, DSC/CSI, I2C, SDIO, LIN, CAN, Ethernet, MODBUS, Power Line Communication PLC, SPODES / DLMS, CF / MMC / SD, DVI, LAN, LCD, LPC, PCI, PCI-E, SATA etc.
• Battery Design, Battery Management Design
• Power electronic device development includes both hardware and firmware creation for battery management systems, power chargers, power supplies, motor controllers, pulse generators, and other power electronic systems with MOSFET, IGBT, GaN, and other types of transistors and can make both low-voltage and high-voltage solutions
• Application-specific integrated circuits, Field-Programmable Gate Arrays (FPGA) can be programmed and reprogrammed after manufacturing. They are used in consumer electronics, telecommunications, data centers, and robotics. Simpler solutions can be created based on complex programmable logic devices (CPLD). Our team has in-depth knowledge of Hardware Description Languages (HDL) and FPGA development tools. So we can offer architecture development, FPGA design and testing, and IP core configuration
• Output Protection - Short Circuit, Over-Current, Over-Voltage, Under-Voltage Protection
• Input Protection - Short Circuit, Over-Voltage, Under-Voltage Detection And Protection
• Digital IOs / Bus - Interference, Short Circuit, Over-Current, Over-Voltage, Under-Voltage Protection
• Design for Wireless - Wifi, Bluetooth, NFC, NRC, Radio, UNB LPWAN, SigFox, LoRaWAN, NB-IoT, GSM, GPRS, GPS, LTE etc.
• Design for BLDC, DC / Stepper Motors, Solenoid, LED, and DC-DC, Magnetic Sensors, Inductive Position Sensor, Encoders etc.
• Filters, Protection devices, Isolation, Creepage and clearance design

• Circuit Modeling, Simulation and Analysis

• DC Operating Point Analysis, AC Sweep Simulation for Frequency Response of Circuit, Transient Simulation for Time-Domain Simulation of the Circuit, DC Operating Point Analysis
• Single Frequency AC Simulation, Parametric Sweep Simulation, Monte Carlo Simulation Explores how Changing Component Properties affect Circuit Performance
• Thermal / Shot / Flicker Noise Analysis, Temperature Analysis, Signal Distortion Analysis
• Fourier Series Analysis to Analyze the Frequency Content of a Periodic Signal, Sensitivity Analysis to find the degree to which an Output is Sensitized to Input Variables
• Worst Case Analysis, Noise Figure Analysis, Pole Zero is a Small-Signal AC Analysis w-100 Computes the Poles and Zeroes of a Transfer Function
• De-Rating Analysis, Power Analysis, Reliability Prediction (MTBF) as Per MIL-HBK-217, FMEA Analysis as per MIL-STD-1629​
• Transfer Function Analysis calculates the DC Small-Signal Transfer Function between an Input Source and Output
• Trace Width Analysis calculates the Minimum Trace Width needed in the Design to Handle the RMS Current on any Trace etc.
• RF Circuit Design Features needed to Design, Analyze and Simulate RF Circuits - Spectrum Analyzer and Network Analyzer, RF-Specific Analyses - Circuit Characterizer, Matching Network Cells, Noise Figure
• Analog Simulation, Digital Simulation, Mixed-Mode Simulation
• SPICE Simulation, Theoretical Calculations, Performance Analysis Charts, Industry Best Practices, IEEE, Journals and Publications, Domain Experts Knowledge, Guidelines, Regulations, Articles and Patents

• BOM - Detailed Bill of Materials Preparation

• Design BOM - Selected Component's Technical Details, Critical Technical Parameters of the each Component, 3/5 alternate manufacturer including MPN of each component, other technical details of the components including wattage / precision / Accuracy / Max Voltage / TC / PPM etc., Size / Shape / Formfactor / packaging of the component, Lifecycle and Obsolescence Management, Cost of the component, Quantity required per circuit of the each component
• Manufacturing BOM - components information more from the manufacturing perspective i.e. Technical / packaging / handling / processing before final assembly / final assembly, Some parts require processing—like pad printing, painting, or programming—before they are ready to be assembled into a final product. While only the altered part is assembled into the final product, both the pre-processed base part and the finished part are represented on the manufacturing BOM. The manufacturing team needs to know about all the processing steps in order to make critical decisions about which steps will be performed in-house and which will get outsourced to a separate vendor. The location of the processing may be changed during the life of the product to reduce costs, improve quality, or increase flexibility. Only the programmed chip is in the final product, but the blank IC and the correct revision of firmware are needed to create the programmed chip. Manufacturing often changes the location of easily transferred processes like programming depending on the production lifecycle stage. Lifecycle and Obsolescence Management

• PCB Design

• PCB Design - rigid, flexible, multilayer, RF, HDI boards, high-speed PCBs, mixed signal multi-layer PCB layout and other types.
• number of layers, size of the enclosure
• analyze signal integrity
• evaluate electrical limitations to ensure the safety of the product
• Proper conductor routing
• analysis for complex multi-processor and multi-layer boards
• DFM/DFA analysis, Micro BGA/ Micro Via, Database Construction and Verification, Library Development, Schematic Capture, Rules Driven Designs, Signal Integrity/ Design Verification, EMI Checking and Full Document Package Creation
• Highly dense and complex small footprint PCBs
• Design footprints for components - consider several criteria to ensure accurate and reliable soldering, proper component alignment, and optimal electrical performance - Component Datasheets, IPC Standards, Component Geometry, Pad Design, Solder Mask and Paste Mask, Keep-out Zones, Thermal Considerations, Silkscreen and Reference Designators, Manufacturing Constraints, Verification and Validation, Documentation
• Component placement - crucial role in the overall performance, reliability, and manufacturability of an embedded system, accurate and reliable soldering, proper component alignment, and optimal electrical performance - Signal Integrity, Thermal Management, Power Distribution, Component Clearance and Mechanical Constraints, Electromagnetic Compatibility (EMC), Manufacturing and Assembly, Design for Testing (DFT), Documentation and Clarity, Design Rules and Constraints, Iterative Optimization
• Electro-mechanical verification - Dimensional Compatibility, Mechanical Stress and Strain, Electrical Connection, Electrical Grounding, EMI/EMC Compliance, Thermal Management, Mechanical and Electrical Safety, Functional Integration, Environmental Durability, Documentation and Standards Compliance
• PCB layout - to ensure the functionality, performance, manufacturability, and reliability of the printed circuit board - Component Placement, Signal Integrity, Power and Ground Planes Incorporate, Routing and Trace Considerations, Thermal Management, Design for Manufacturing (DFM), Design for Testing (DFT), EMI/EMC Considerations, Component and Footprint Selection, Documentation and Verification, Revision Control
• Deliver world-class PCBA that are certifiable, deliver highest performance, manufacturable, low cost and thermally-efficient
• high-speed, digital and mixed-signal PCB layouts for VME, VPX, cPCI, PCIe, XMC bus and custom architectures, MIL standard Class-3 PCB and HDI PCB assemblies
• PCB Design Analysis Services includes Library management, PCB Layout and Analysis, Power Integrity Analysis Services, Signal Integrity Analysis Services, Simulations and 3D modelling, Structural Analysis Services and Thermal analysis Services. Compliance with DFM, DFA, DFT, and the international IPC standards
• Professional tools such as Altium Designer, Cadence Allegro, Eagle Cad, OrCad, KiCad, CAD, Allegro, ExpressPCB, Multisim, Protel, DEP, CAM350, PCAD, Coral Draw UCAM etc.
• Advanced component footprints & library creation including BGA, QFN packages as per IPC standards
• High speed PCB design including differential pairs, length matching etc.
• PCB reverse engineering service, Re-engineering services to correct flaws or to optimize existing PCB designs for lowering costs, Upgrade old PCBs with outdated & obsolete components to the latest technology with widely available SMT components
• Gerber, drill files & PCB File. Files for РСВ production (Gerber 274-X, CAM350, ODB++). PCB documentation, including mounting drawing, datasheet, and РСВ drawing, compliant with IPC standards or client requirements.
• Micro-via technology / blind and buried vias.
• High Speed design / Signal Strength / RF design. Analog design – Energy Supplies

• Test Tool Design

• Test Tool Designs
• Test Automation
• Auto Test Report Generation / Test Logger
• Testing Accessories Designs
• Mass Testing
• Long term Testing / Destructive Testing / Hazard perception Test

• Manufacturing Production and Test Jig Design

• Manufacturing Production and Test Jig Design
• In-Circuit Testing (ICT) - using “bed of nails” fixture, ICT checks for short circuits, opens, resistance, capacitance, and other parameters. The test will flag any discrepancies.
• FCT, or Functional Circuit Test - check the functionality and integrity of printed circuit boards. FCT covers testing the board by stimulating its input and output signals, like the voltage, current, and power, thereby assessing its components' response.

Development

Components Procurement, PCB manufacturing, PCB Assembly, Wiring and Harnessing, Jigs and fixtures

In the Electronics Hardware Development Phase, engineers follow a meticulous process. We procure off-the-shelf components and fabricate custom ones, including the PCB. During PCB assembly, components are meticulously soldered onto the PCB, ensuring precise placement. Additionally, wiring harnesses, containing bundles of wires, connect components and are meticulously routed and secured. Throughout these steps, attention to detail, collaboration among engineers, and adherence to design guidelines are crucial. The ultimate goal is to create Reliable and Efficient Electronic Hardware for the intended application.

• Components Procurement

• Procurement of off-the-shelf components

• Custom Components Procurement including PCB - follow manufacturing / fabrication steps

• Components Sourcing - locating multiple sources
• Negotiating Terms
• Components Purchasing
• Receiving and Inspecting components
• Record Keeping

• PCB Manufacturing

• PCB details - Length, Width, Shape and Geometries, Thickness and Warpage, Copper thickness of each layer, number of layers, Layer stackup, BGA, SMT, Cutouts, Complexity and Functionality
• PCB Material - FR4 PCB, For Flex, Rigid-flex, Metal-based (Aluminum etc.), HDI, Halogen-free, High Tg - Isola, FR408HR, DuPont Pyralux, and Nelco N7000-2HT, etc.
• PCB - Trace width, Track spacing, component spacing, hole diameters, slots, Width of Annular Ring, tolerances etc.
• PCB Finishing - Surface Finishing - HASL with lead, HASL lead free, Immersion gold, OSP, Electrolytic nickel and gold, Electroless Nickel with Immersion Gold Coating (ENIG), Immersion silver, Electrolytic wire bondable gold. Solder Mask, Legends, Silkscreen, coating- HASL(+gold finger),immersion gold, Immersion Gold +gold fingers with hard gold, OSP (+gold finger with hard gold), Immersion Tin (+gold finger with hard gold), Immersion Tin
• PCB Panelization - V-scoring, Tab-routing, Tab-routing with Perforation (Stamp Holes)
• PCB Impedance control - Ensuring consistent signal integrity for high speed pcbs
• Standards - IPC class 1 standard - General Electronics, IPC Class 2 standard - Dedicated service electronics - Laptops, Microwaves, and some mining equipment, IPC class 3 standard - High-reliability electronics - Aerospace, military, & medical applications.

• PCB Assembly

1. Solder Paste printing on top layer of PCB
2. SMD Components Placement on top layer of PCB
3. Reflow Soldering on top layer of PCB
4. Flipping PCB
5. SMT adhesives on bottom layer of PCB
6. SMT Components Placement on bottom layer of PCB
7. Solidification on bottom layer of PCB
8. Flipping PCB
9. THT Components Placement on top layer of PCB
10. Wave Soldering on top layer of PCB

• Wiring and Harnessing

• Wire selection - Wire specifications, Environmental conditions, Mechanical properties
• Wire connection - termination end type - Hooks, Rings, Bullets, Spades
• Routing - wiring according to their function, voltage, and signal type, which will help prevent interference and ensure the wires correctly connected to their respective devices
• Strain relief - identify potential sources of stress, proper cable management, wire harness is flexible and allow for movement and bending as necessary while maintaining its structural integrity, protect wire harness assemblies with components such as grommets, cable clamps, or cable ties etc.
• Protective covering - Protection against vibration, rattles, fluids, and chemicals etc, Protective coverings vary by type, from pulled-on braided tubing (or loom) to tapes, spiral wrap, and heat-shrink sleeves, which also ensure neat wire bundling
• Testing and Documentation - Wire-harness diagram
• Standard Compliance - environmental conditions, strength or chemical resistance
• wire cutting, preparation, soldering, crimping, Moulding/potting, marking/labelling and wire harness routing/securing, marking with label printer and automatic machine for cutting/crimping/marking/pull testing

• PCB Assembly and PCB Testing - Jigs and fixtures

• In-Circuit Testing (ICT) - using “bed of nails” fixture, ICT checks for short circuits, opens, resistance, capacitance, and other parameters. The test will flag any discrepancies.
• FCT, or Functional Circuit Test - check the functionality and integrity of printed circuit boards. FCT covers testing the board by stimulating its input and output signals, like the voltage, current, and power, thereby assessing its components' response.

Functional Testing

Inspection, Checking, Examination, Testing Execution, Conformance, Performance, Review, Verification, Acceptance, Approval

Testing can check the correctness of Electronics Hardware for scenarios. Testing can provide objective, independent information about the quality / performance / protection / secure / ruggedness / breakpoints of Electronics Hardware Development.

• Components Procurement

• White Box Testing - Unit Testing
• Black Box Testing - Functional Testing, Non-Functional Testing
• Performance Testing
• System Testing / Integration Testing
• User Acceptance Testing
• Pre-Compliance / Custom Compliance Testing

• Testing Types

• Load Testing
• Stress Testing
• Endurance Testing
• Spike Testing
• Breakpoint Testing
• Configuration Testing
• Isolation Testing
• Protection Testing
• Destructive Testing
• Nondestructive Testing
• Connectivity / Communication Testing

• Functional Testing

• Functionality Testing
• Features Testing
• Performance Testing
• Safety Testing
• User Experience Testing
• Future Testing
• Modularity Testing
• Security Testing
• Ease of Development Testing
• Data Acquisition, Processing, and Storage - Precision/Accuracy/Range/Performance/Testing
• Connectivity Testing
• Power Testing
• Physical Device Design - Inspection / Industrial Review / Checking / Testing
• Expected Shelf Life Testing
• Expected Operating Life Testing
• Functional Testing - a form of system testing that verifies whether Electronics Hardware Development matches its design
• Non-functional testing – Testing for non-functional behavior
• Acceptance testing – Test to determine if the requirements of a specification or contract are met
• Regression testing – Checking whether changes have broken functionality that used to work
• System testing – Testing conducted on a complete system
• Testing – Checking against a standard
• Integration testing – Type of testing
• Unit testing – Validating the behavior of isolated each feature / function block / component / group
• Security testing – The process of finding flaws in the security of systems
• Load testing – Process of putting demand on a system and measuring its response
• Test automation – Use of special software to control test execution and analysis

• Non-Functional Testing

• Accessibility testing
• Baseline testing
• Compliance testing
• Documentation testing
• Endurance testing or reliability testing
• Load testing
• Localization testing and Internationalization testing
• Performance testing
• Recovery testing
• Resilience testing
• Security testing
• Scalability testing
• Stress testing
• Usability testing
• Volume testing

Development Release

At this Release stage, all technical and project related documents are released to the client that includes calculations and outputs related to Electronics Hardware Design and PCB (Printed Circuit Board) development/fabrication, Prototypes, IP asset etc.

• Requirement Specification Document, Project Plan, Monitoring Status Reports, Project Documents, Technical Documents, Quality Team Audit Report
• Electronics Hardware Design document : Design document contains the step by step progress of all parts of design, that is electronic design, industrial design, software designs. Basic reasoning behind selection of the component, circuits, process, values etc. The reasoning for selection of right component.
• Production document : This document should contain all the information to produce a product on large scale, and final drawings or documents, which are issued by, design department. Faultless method of producing a product on a large scale.
• User's manual : It is a complete user's guide and includes installation, theory of operation, operating instructions, periodic maintenance guide, servicing manual etc. The handling of the equipment.
• Block diagram of the complete system
• Circuit Modeling, Simulation and Analysis :
• Analog Simulation, Digital Simulation, Mixed-Mode Simulation
• RF circuit design features needed to design, analyze and simulate RF circuits - Spectrum Analyzer and Network Analyzer, RF-specific analyses - circuit characterizer, matching network cells, noise figure
• SPICE Simulation, Theoretical Calculations, Performance Analysis Charts, Industry Best Practices, Domain Experts knowledge, guidelines, Regulations, Articles and Patents
• Schematic :
• Project Hierarchy, Schematic Capture, Symbols, Nets Rules, grouping nets/circuit Footprint, Libraries, Constraints, defining Zones, Geometry, Layers, Component Cross Reference
• Wiring Diagram, Harness Wire, Harness Cable
• Shield, Layout Drawing, Harness Covering, Layout Label
• Netlist Outputs Netlists describe the logical connectivity between components in the design and are useful for transferring the design to other electronics design applications. A large variety of netlist formats are supported.
• PCB Documentation Outputs :
• Component Placement and Routing the Board - Design Rules, Strategies, constraints, Best Fits and Violations and Feedback, Approvals
• PCB Prints – configure any number or printouts (pages), with any arrangement of layers and display of primitives. Use this to create printed outputs, such as assembly drawings.
• PCB 3D Prints – views of the board from a three-dimensional view perspective.
• PCB 3D Video – output a simple video of the board based on a sequence of 3D key-frames defined in the PCB editor's PCB 3D Movie Editor panel.
• PDF 3D – generate a 3D PDF view of the board with full support to zoom, pan, and rotate in PDF. The PDF includes a model tree, giving control over the display of nets, components, and the silkscreen.
• Schematic Prints – schematic drawings used in the design.
• Draftsman – Draftsman drawings added to the project.
• PCB Verification report - DRC Violations Display, Overlay & Details
• Assembly Outputs :
• Assembly Drawings – component positions and orientations for each side of the board.
• Custom parts like Transformer, Inductor, Choke, etc. construction details, calculation and design documentation
• Database of datasheets of purchase parts/BOM with manufacturer alternatives
• Pick and Place Files – used by robotic component placement machinery to place components onto the board.
• Test Point Report – as ASCII file, available in 3 formats, that details the location of each pad/via that has been nominated as a testpoint.
• Fabrication Outputs :
• Gerber Files, Gerber X2 Files, IPC-2581 File – creates manufacturing information in Gerber format.
• Final Artwork Prints – combines various fabrication outputs together as a single printable output.
• Drill Drawing/Guides, Composite Drill Drawings – drill positions and sizes (using symbols) for the board in one/separate drawing.
• NC Drill Files – creates manufacturing information for use by numerically controlled drilling machines.
• ODB++ – creates manufacturing information in ODB++ database format.
• Power-Plane Prints – creates internal and split plane drawings.
• Solder/Paste Mask Prints – creates solder mask and paste mask drawings.
• Test Point Report – creates test point output for the design in a variety of formats.
• Assembly structure diagram, Special instructions, Calibration
• Specifications, Installation procedure
• Films of PCB for PCB Manufacturing
• Connector details Internal Connector and Settings, DNM/DNP - Do not Mount/Put, External Connectors
• Bill of Materials – creates a list of parts and quantities (BOM) in various formats required to manufacture the board.
• Component Cross Reference Report – creates a list of components based on the schematic drawing in the design.
• Report Project Hierarchy – creates a list of source documents used in the project.
• Report Single Pin Nets – creates a report listing any nets that only have one connection.
• Validation Report Generation - It includes a number of validation checks, which can be included as an output, during output generation. During the project release process, these checks will be performed prior generation of other outputs, and if any validation checks are not passed successfully, the release will fail.
• Testing - Standards, Test procedure, Test tables, Test results
• Labelling, User Manual, Installation instructions, Training, Service Manual, Periodic maintenance guide, Preventive maintenance, Trouble-shooting

Compliance Testing (Optional)

Regulatory Compliance Testing - EMI EMC HALT HASS etc.

Compliance Testing is an independent EMC/RF compliance testing and product certification service provider for prototype and finished electrical and electronic products. Goal is to certify products, ensuring their compliance with applicable regulatory standards, Federal standards, industry standards, regulations, or recommendation and best practices and to unlock access to world-wide markets.

• CE - Conducted Emission
• RE - Radiated Emission
• CS - Conducted Susceptibility
• ESD - Electrostatic Discharge
• EFT - Electrical Fast Transient
• PFMF - Power-Frequency Magnetic Fields
• Current Harmonics
• Transient Immunity
• Voltage Dips Test
• Voltage Variations Test
• Superimposed Voltage Test
• Voltage Rise and fall Test
• Short Circuit Protection
• Open Circuit Test
• Overvoltage Test
• Surge Test
• Environmental and Mechanical Testing
• Vibration Test - Vibration (Operating & Endurance)
• Temperature Stress Test - Temperature, Temperature Shock
• Salt corrosion, Dust, Water Exposure
• Universal Test Tensile Testing
• ESS - Environmental Stress Screening / HALT - Highly Accelerated Life Testing / HASS - Highly Accelerated Stress Screening Testing
• Shock (Operating, Gunfire, Ballistic, Handling)
• Humidity, Immersion, Salt Fog, Sand & Dust
• Altitude

• IEC - International Electrotechnical Commission
• UL - Underwriter’s Laboratory
• FAA - Federal Aviation Administration
• SAE - Society of Automotive Engineers
• MIL-PRF - Military Performance Specification
• MIL-STD - Military Standard
• CE - Conformité Européenne etc.
• ANSI - American National Standards Institute
• IPC - Association Connecting Electronics Industries
• ASME - American Society of Mechanical Engineers
• RoHS - Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment
• ISO - International Organization for Standardization, ISO 13485 for medical devices
• ITU - International Telecommunication Union
• DIN - VDE - Deutsche Institut für Normung - Verband der Elektrotechnik
• TUV - Technischer Überwachungsverein (in German) - Technical Inspection Association

Alpha Testing (Optional)

White box and Black box testing focusing on user acceptance testing by the developers

Alpha Testing is a type of testing performed to identify bugs before releasing the product to real users or to the public. Alpha Testing is one of the user acceptance tests. It is the first stage of testing, during which the internal development team tests the features before making it available to clients or people outside the company. Finding and fixing bugs, flaws, and usability issues is the main goal before releasing the product for external users or wider testing. Alpha testers are few in number and frequently comprise members of the development team or those intimately connected to the project. Alpha testing is typically carried out in a development environment or laboratory that resembles actual settings.

• Involves both white box and black box testing focusing on user acceptance testing
• Usually internal development team / employees performs alpha testing at development environment / developers site testing lab
• Alpha testing ensures the quality of the product before forwarding to beta testing.
• Developers can immediately address the critical issues or fixes in alpha testing. Generally Multiple test cycles are organized in alpha testing.
• Generally Reliability and security testing are not checked in alpha testing.

Beta Testing (Optional)

Black box testing performed by real end users in real environment to ensures that the product is ready to big market

Beta Testing is performed by real users of the application in a real environment. Beta testing is one type of User Acceptance Testing. A pre-release version of the product is made available for testing to a chosen set of external users or customers during the second phase of testing. The primary objective is to get input from actual users in order to find any bugs, usability difficulties, or areas that need to be improved before the product is formally released. In order to capture a variety of viewpoints, a larger number of users—including a varied range, can serve as beta testers. Real-world settings are used for beta testing to simulate how users will interact with the program while performing daily duties.

• Beta testing commonly uses black-box testing.
• Beta testing is performed by clients who are not part of the organization. Beta testing is performed at the end-user of the product.
• Reliability, security and robustness are checked during beta testing.
• Beta testing also concentrates on the quality of the product but collects users input on the product and ensures that the product is ready for real time users.
• Beta testing doesn’t require a testing environment or lab.
• Beta testing requires only a few weeks of execution. Only one or two test cycles are there in beta testing.
• Most of the issues or feedback collected from the beta testing will be implemented in future versions of the product.

Mass Manufacturing (Optional)

High volume production, ease of manufacturing, ease of assembly, functional pilot batch

High volume Buy and assemble the components, PCBs are put into production, and ease of assembly is verified. Then, we place orders for the device enclosure (cases) that look like the final version. After PCBs are assembled, the first launch (so-called 'bring-up') is performed. Next, the operating system and the bootloader are ported, high-level software, system, and drivers are elaborated. Finally, specialists assemble the device components and perform thorough integration testing. When testing results are achieved, and test operation is performed, we can elaborate on the product's functional requirements and change — if needed — the design documentation package. Any software changes can be dealt with during other stages because most do not require changes at the hardware level. As a result, a functional pilot batch ready for integration testing is created by the end of this stage. When testing is completed, design documentation can be amended when needed. Establishment of Production line and production control processes with high production performance and yields. Mounting, assembly, packaging, and repairs at the production site.

• Focused Activities

• High volume Components Purchase
• Production Pilot Run
• Ease of Manufacturing verified
• Ease of Assembly verified
• High Volume Production - Manufacturing

• BOM - Detailed Bill of Materials Preparation / Management

• Cost Optimization - Short procurement times, Affordable Prices, Assured Quality, Hassle-free, identifying and eliminating unnecessary expenses
• Strategic Sourcing - sourcing components with considering factors like cost, quality, lead time, and supply chain reliability
• Budgeting and Forecasting - Accurate BOM cost calculations is crucial for effective budgeting and financial forecasting, helping businesses plan for future investments and expansions
• Competitive Pricing - Understanding the detailed cost structure of products allows companies to price their offerings competitively in the market while maintaining healthy profit margins
• Scalability - easily adapt to the growing complexity and size of BOMs in large electronics divisions, ensuring scalability and flexibility
• BOM - advanced analytics with precision, configurable alerts, contextual insights, Leverage Analytics, Integrate Real-Time Market Data, Collaborate and Negotiate

• Activities

• Full-scale Industrial Manufacturing
• Supply Chain Management
• Planning, Forecasting and Inventory Management
• Technological Process Control
• Validate DFM DFT
• Product Quality Control
• Quick Reaction to components replacements (for example if any component is not available, etc.)
• Determination of causes for defects that occur during production (violation of technological processes, low quality of initial components)
• Increasing the test coverage and improvement of test procedures for detected bottlenecks
• Optimizing the Production process to save money on costs
• Quality Assurance

Support (Optional)

Post Production Technical Support and Troubleshooting, Training and Documentation

Beyond the product development and manufacturing phases, providing comprehensive post-production support to ensure the longevity and continued success of your IoT solutions. After-sales services are designed to help our clients maintain the optimal performance of their products, address any issues that may arise, and stay updated with the latest firmware. Our dedicated team of engineers and technicians are always ready to assist with any technical challenges, ensuring that your products remain at the forefront of technological innovation.

• Firmware Updates and Maintenance
• Technical Support and Troubleshooting
• Training and Documentation
• End-to-end support - All aspects (software, hardware, configuration, integration, connectivity, security, etc.) of the deployed solution are administered, supported and maintained by a dedicated staff. Quality fixes to issues, Minor enhancements, Proactive maintenance of existing configuration and code, Patches, upgrades, bug fixes, repairs, and business emergencies.
• Release management - consultants manage, schedule, and communicate all pertinent information regarding upcoming production changes.
• Troubleshooting customer-specific issues